JPH0737296Y2 - トランス - Google Patents
トランスInfo
- Publication number
- JPH0737296Y2 JPH0737296Y2 JP1989098330U JP9833089U JPH0737296Y2 JP H0737296 Y2 JPH0737296 Y2 JP H0737296Y2 JP 1989098330 U JP1989098330 U JP 1989098330U JP 9833089 U JP9833089 U JP 9833089U JP H0737296 Y2 JPH0737296 Y2 JP H0737296Y2
- Authority
- JP
- Japan
- Prior art keywords
- primary
- winding
- secondary windings
- supporting
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004804 winding Methods 0.000 claims description 132
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 23
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Insulating Of Coils (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989098330U JPH0737296Y2 (ja) | 1989-08-23 | 1989-08-23 | トランス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989098330U JPH0737296Y2 (ja) | 1989-08-23 | 1989-08-23 | トランス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0338611U JPH0338611U (en]) | 1991-04-15 |
JPH0737296Y2 true JPH0737296Y2 (ja) | 1995-08-23 |
Family
ID=31647436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989098330U Expired - Fee Related JPH0737296Y2 (ja) | 1989-08-23 | 1989-08-23 | トランス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0737296Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10049808B2 (en) * | 2014-10-31 | 2018-08-14 | Samsung Electro-Mechanics Co., Ltd. | Coil component assembly for mass production of coil components and coil components made from coil component assembly |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5249707U (en]) * | 1975-10-06 | 1977-04-08 |
-
1989
- 1989-08-23 JP JP1989098330U patent/JPH0737296Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0338611U (en]) | 1991-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |